Lead Product Engineer

Role: Senior Product Lead

Location: Remote

Employment type: Full-time

Job Description: Senior Product Lead - Advanced Packaging and Semiconductor Electronics

Company Overview

Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.

Position Overview

We are seeking a highly experienced Senior Product Lead with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging.

Key Responsibilities

• Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs.
• Act as Technical Lead on Heterogeneous Integration projects using chiplet and advanced packaging technologies.
• Provide key insights and direction for the design, manufacture, and test of heterogeneously integrated systems using various chiplets, substrates, and advanced packaging.
• Define and document Advanced Packaging Architecture.
• Ensure the successful delivery of heterogeneous systems from Applied Materials with collaboration from our partners and/or ecosystem.
• Drive advancements in chiplet integration and high-speed chiplet I/O.
• Ensure signal and power integrity throughout the design and implementation phases.
• Stay abreast of the latest trends and technologies in advanced packaging and semiconductor processing.
• Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects.
• Mentor and guide junior engineers, fostering a culture of continuous learning and innovation.

Required Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• At least 10 years of experience in semiconductor electronics and ASIC design.
• Proficiency in mixed-signal design and chiplet design.
• In-depth knowledge of advanced packaging, BEOL and FEOL semiconductor processing.
• Experience with current packaging technologies and substrate technologies for advanced packaging.
• Strong expertise in chiplet integration and high-speed chiplet I/O.
• Proven track record in ensuring signal integrity and power integrity in complex designs.

Preferred Qualifications

• Ph.D. in a relevant field.
• Experience with leading industry-standard design and simulation tools.
• Published works or patents in semiconductor technologies.
• Excellent leadership, communication, and project management skills.